ABS812-ZJS semiconductor mono-crystalline silicon truncating machine is a dedicated device that aims at truncating large size semiconductor mono-crystalline silicon ingot. It can process the ingot with the diameter of 8 inches and 12 inches .The maximum length of silicon ingot that can be processed is 3300mm.The machine adopts saw to cut. It has the function of truncating, removing head and tail, cutting sample and so on. The advantages for saw cutter includehigh cutting efficiency, outstanding truncation surface quality and others. The technology of the machine is introduced fromSaito Seiki co.，LTD（Japan）, which is of international advanced level.